***********************************************************************
***********           PANJIT International Inc.             ***********
***********************************************************************
*Mar 17, 2025                                                         *
*                                                                     *
*This SPICE Model describes the characteristics of a typical device   *
*and does not respresent the specification. Designer should refer to  *
*the same type name data sheet for specification limits.              *
***********************************************************************
*$
.subckt P6SMB200A  A K 
.param
+vc0 = 4.746e-9		vc1 = 2.916e-10		vc2 = 1.000e0		vc3 = 1.013e-10		vc4 = 3.355e-2
+tc1 = 5.918e-2		tc2 = 3.445e-2		tc3 = 4.108e-2		tc4 = 2.695e-2		   
.func irexp(v) {(vc0+vc1*v**vc2)*(1.0+tc1*(temp-25)*exp(tc2*(temp-25)))+(vc3*exp(vc4*v))*(1.0+tc3*(temp-25)*exp(tc4*(temp-25)))}
.func rbv(i) (2.224e+1*min(i,0)}
d1 A A1 zener
g1 A1 A value = {irexp(v(A1,A))}
v1 A1 K1 0
e1 K1 K value = {rbv(i(v1))}
.model zener d
***** flag parameter *****
+level = 1 
***** dc model parameter *****
+ is = 2.256e-9	       n = 1.576         rs = 1.519e-2
+ibv = 1.0e-3		 nbv = 1.000	  bv = 200
+ikf = 6.875e-2
***** capacitance parameter *****
+cjo = 2.432e-10	   m = 3.594e-1		  vj = 5.630e-1
+ fc = 0.5
***** temperature coefficient *****
+tnom = 25		      eg = 0.980		      xti = 3
+trs1 = 5.527e-4		trs2 = 6.507e-6	      tikf = 1.000e-2     
+tbv1 = 9.386e-4 	tbv2 =-5.812e-7
.ends P6SMB200A
*$
